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Published in:   Vol. 5 Issue 1 Date of Publication:   June 2016

Multi-Mosfet Based Series Resonant inverter for Induction Heating Applications using Soft Switching

P Guna Chandraleela,J Mahadevan

Page(s):   62-64 ISSN:   2278-2397
DOI:   10.20894/IJWT. Publisher:   Integrated Intelligent Research (IIR)

This Project mainly focus on induction heating applications due to their high efficiency and high power density. By using half bridge series resonant inverter and PFC boost converter. The proposed circuit has lesser THD compared to the existing topology. Selective harmonic elimination is applied to lower the harmonics. The proposed circuit is simulated using MATLAB 7.10.0 (R2010a) version. The proposed converter is based on a multi-MOSFET cell implementation, reducing the equivalent on-state resistance per chip-area. A series resonant converter capable of delivering up to 4 kW has been built, reducing conduction losses against the classical IGBT-based converter. In addition to this, the reduced switching times of MOSFET devices decrease switching losses, further increasing the conversion efficiency. High frequency electrical heating is more advantageous as compared to other power frequency electrical heating for domestic cooking purpose. This type of heating is broadly categorized into two i.e., dielectric heating and induction heating. Microwave oven is the application of dielectric heating and induction heater is the application of induction heating.This high frequency current produces a high frequency alternating magnetic field through an induction coil. Mirror inverter, which is a half bridge series resonant inverter is used in the present thesis as it offers reduced switching losses for the power-devices and possess attractive possibilities for high frequency operations. Moreover, higher efficiency, lightweight, overall simplicity in terms of inverter control, protection and maintainability of mirror inverter have made it very attractive.. The main design challenges including the device selection, gate drive circuit, and cooling have been addressed. As a conclusion, a low-profile implementation without fan and heat sink is obtained, which significantly improves state-of-the-art technology in terms of efficiency and power density